On Tuesday next week (6th June) the Computex trade show opens in Taipei.
There’s a few things to watch out for at the show that could be relevant to UMPC’s including devices based on the new Intel ultra-low voltage processors with Yonah (65nm) core. (Celeron-M and Core Solo 1.06Ghz CPU’s.) The VIA VX700 integrated north/southbridge chipset which is perfect for UMPC’s should get a showing too.
Expect to see new UMPC’s announced in Taipei too. Not only becuase its an important trade show and there will be over 1200 exhibitors there, but because of what was written at the Enquirer last week:
[Daniel Robinson] cites VIA as predicting designs half the thickness of the ill-fated Samsung Q1 at Computex in Taipei next month.
There’s a strong UMPC flavour at the Via technology Forum too with the Ultra mobility track. Speakers at the forum will include Otto Berks, GM Mobile Plaforms division at Microsoft, Rob Enderle from the Enderle group advisory company, Phil Hester CTO at AMD and Dennis Luo project manager for UMPC’s at Microsoft.
All-in-all it could be a significant week for UMPC’s. We’ll be following closely.
Steve /Chippy.
