I expect VIA’s mobility group are happy this morning. The two new ultra mobile PC devices announced yesterday were both based on the VIA C7-M ULV processor with the VN700 chipset. The only disappointment for them was that Samsung announced the new Q1P-SSD and forgot to mention that they have a VIA version of the Q1 in their press release.
Although Intel have the Santa Rosa platform planned (with the Steeley low-power processor.) it obviously not quite ready yet and so it gives VIA a chance to move forward with the C7-ULV and V700 combination (and soon, the John ‘Core Fusion’ system on chip.) [See the CPU update for more info.]
Over the next 24 hours I expect we’ll see a few more devices through the Microsoft Origami team. There’s the Yahoo-related (in what way, we don’t know) ultra mobile PC with he twist-screen and I guess there will be a few other devices that we haven’t seen yet. I wonder how many will be VIA and how many will be Intel!
Steve.
